NCMS Lead-Free Soldering Project and NEMI Lead-Free Task Force.

Lead-free and Tin-lead Rework Development Activities within the Nemi Lead-free Assembly and Rework Project

With the upcoming European ROHS legislation and other global movements to lead-free assembly, the NEMI lead-free rework group investigated and developed lead-free rework processes for medium to high-end computer products. The work concentrated on development of lead-free hot air convection rework for PBGA, CBGA, and uBGA, and lead-free hand soldering rework for TSOP and 2512 chip components on ...

Lead-free Soldering Effect on Tantalum Capacitors

Legislation is being developed worldwide to reduce the lead content in many consumer electronic products. This is being taken as an action to reduce environmental impact when such products are discarded. Despite the fact that lead containing solders in electronic assemblies account for only 0.49% of world lead consumption, the trend in legislation will likely be to require not only reduced lead...

Lead-Free Soldering for Space Applications Lead-Free Solder Body of Knowledge

Lead-Free Selective Soldering: The Wave of the Future

The European perspective on waste management and recycling as described in the European Union’s Waste of Electrical and Electronic Equipment (WEEE) and Restriction of Hazardous Substances (ROS) strongly suggests that lead-free electronic assemblies will be mandatory in Europe by 2008. Japan is moving toward voluntary compliance by 2003 with a lead-free initiative that focuses on environmental m...

Lead-Free Soldering – Where The World Is Going

Lead-free soldering for electronic industry is a segment of global trend toward lead-free environment. Although initiated in U.S. in early 1990’s, it advanced much more rapidly in Japan and Europe. This differentiation in Pb-free progress triggered great concerns of users of Pb-containing solders about maintaining business opportunity, therefore further expedites the advancement of Pb-free sold...